Processes
LIDE® (Laser Induced Deep Etching)
LIDE® technology enables precise microstructuring of glass without mechanical damage or residual stress. This revolutionary process achieves deep, high-quality features with aspect ratios of up to 50:1 and sub-micrometer accuracy, all while maintaining the glass's inherent properties. Unlike conventional methods, LIDE® is not limited to specific glass types, offering unmatched versatility for a wide range of applications.
Thin Film Deposition
Looking for reliable metallization or surface preparation for anodic bonding? We provide sputter processes for surface functionalization, electrical contacts, conductive paths, TGVs, or silicon thin films tailored for anodic bonding. Our capabilities include handling substrate sizes up to 300x300mm² panels, and structured deposition using fine shadow masks with feature sizes >20µm.
Glass-Glass Welding
Advanced laser glass welding enables direct, permanent bonds with perfect optical transparency. The selective, room-temperature process creates true hermetic seals and strong mechanical connections without additional bonding materials. Our revolutionary
Tensor® Welding Technology ensures high process robustness and enables welding speeds of up to 100 mm/s, significantly increasing manufacturing efficiency. The widened weld seams result in higher bonding strength, while the process exhibits a low sensitivity to surface irregularities, ensuring reliable and consistent weld quality.
Anodic Wafer-Bonding
Permanent glass-glass or glass-silicon connections through controlled anodic bonding at 4” or 6” wafer level. Our process delivers reliable, hermetic seals with excellent mechanical stability.
Part Separation
Precise separation of glass components through advanced dicing technology. Our process enables clean edges and accurate dimensions for both straight cuts and complex geometries at wafer or panel level.
Optical Inspection
Automated optical inspection of wafers and panels for quality assurance. Our systems perform precise dimensional measurements and structural analysis, ensuring consistent product quality.
