Superior Material Benefits
Distinct material advantages that ensure reliable packaging performance:
Precise CTE Control: Optimized thermal matching for reliable bonding
High Mechanical Stability: Superior structural integrity and stress management
Excellent Surface Quality: Optimal bonding and sealing characteristics
Perfect Hermeticity: Long-term protection and reliability
Precise Dimensional Control: Accurate spacing and alignment
Versatile Applications
Enabling innovation and development across industries:
MEMS Integration
Wafer-Level Packaging
Optical Device Protection
Sensor Encapsulation
3D Integration
Quality Assured Manufacturing
Delivering precision and reliability for your sensing and control applications:
Precise control of RF specifications and tolerances
Seamless scaling from prototype to volume
Rigorous inspection of critical parameters
Rapid design iterations and prototyping
Expert technical support and consulting
Customized Packaging Substrates
Precision-engineered packaging substrates ensure reliable integration and protection of sensitive devices. Through sophisticated design capabilities and superior material properties, we enable stress-optimized solutions for MEMS packaging and wafer-level integration, delivering long-term stability and hermetic protection.
Spacer Wafers
Precise thickness control
Excellent flatness
Custom cavity designs
High mechanical stability
Perfect edge quality
Various wafer or panel
Glass Spacer Wafers delivering precise component spacing and alignment. These precision-engineered components combine exact dimensional control with superior mechanical stability for demanding packaging applications.
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Wafer-Level-Capping
Controlled atmosphere sealing
High yield processing
Custom cap designs
Precise cavity control
High mechanical stability
Seamless integration capability
Scalable manufacturing
Protection sensitive devices with Wafer-Level-Capping. Our advanced glass encapsulation technology ensures reliable hermeticity and mechanical stability.
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Stress-Relief Substrates
Minimal residual stress
Superior mechanical stability
Long-term reliability
Custom design flexibility
Controlled thermal expansion
Mechanical stress and shock reduction
Transforming MEMS reliability through mechanical decoupled carrier substrates. Advanced glass processing ensures minimal thermal and mechanical stress, enabling optimal device performance and long-term stability.